Product details
Mechanic XG30 183℃ Special Solder Paste (16g)
Boost your repair precision with Mechanic XG30 $183^\circ\text{C}$ Solder Paste (16g). Perfect for BGA reballing and SMD soldering with high-intensity Sn63/Pb37 alloy. Shop now!
ZAR 35.00
In stock
Delivery: 1-3 Days
Description
Professional Precision for Electronics RepairThe Mechanic XG30 is a high-performance solder paste specifically formulated for the demanding needs of the electronics service industry. With a consistent $183^\circ\text{C}$ melting point and a 3# micron particle size, it ensures smooth application and strong, shiny solder joints every time.Key Features:Optimal Melting Point: The $183^\circ\text{C}$ (Sn63/Pb37) alloy composition provides the perfect balance for medium-temperature soldering, preventing thermal damage to sensitive components.Superior Conductivity: Formulated with high-quality IPX3 flux, it reduces oxidation during the soldering process and ensures excellent electrical connectivity.Excellent Wetting: Strong adhesion properties make it easy to work with on various PCB finishes, reducing solder beads and bridges.Compact 16g Packaging: Perfect for high-precision work like mobile phone BGA reballing, CPU repairs, and SMD component mounting.Technical Specifications:Model: Mechanic XG30Alloy: Sn63 / Pb37Melting Point: $183^\circ\text{C}$Microns: 3# (25-45um)Flux Type: IPX3Weight: 16g